LMC7211BIM/NOPB
vs
MCP6543-E/MS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
MSOP
|
| Package Description |
SOIC-8
|
TSSOP, TSSOP8,.19
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.001 µA
|
0.005 µA
|
| Input Offset Voltage-Max |
18000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
PUSH-PULL
|
PUSH-PULL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
4000 ns
|
4000 ns
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Current-Max |
0.018 mA
|
0.001 mA
|
| Supply Voltage Limit-Max |
16 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Packing Method |
|
TUBE
|
|
|
|
Compare LMC7211BIM/NOPB with alternatives
Compare MCP6543-E/MS with alternatives