LMC7215IM/NOPB
vs
LMC7215IM5/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
SOT-23
|
Package Description |
SOIC-8
|
SOT-23, 5 PIN
|
Pin Count |
8
|
5
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.001 µA
|
0.001 µA
|
Input Offset Voltage-Max |
8000 µV
|
8000 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e3
|
Length |
4.902 mm
|
2.92 mm
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
5
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
PUSH-PULL
|
PUSH-PULL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Equivalence Code |
SOP8,.25
|
TSOP5/6,.11,37
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
17000 ns
|
17000 ns
|
Seated Height-Max |
1.753 mm
|
1.22 mm
|
Supply Current-Max |
0.001 mA
|
0.001 mA
|
Supply Voltage Limit-Max |
10 V
|
10 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.953 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3.899 mm
|
1.6 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LMC7215IM/NOPB with alternatives
Compare LMC7215IM5/NOPB with alternatives