LMC7221BIMX
vs
LMC7221BIM5/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
SOT-23
|
| Package Description |
SOIC-8
|
SOT-23, 5 PIN
|
| Pin Count |
8
|
5
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
4e-8 µA
|
4e-8 µA
|
| Input Offset Voltage-Max |
18000 µV
|
18000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4.902 mm
|
2.92 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Response Time-Nom |
7000 ns
|
7000 ns
|
| Seated Height-Max |
1.753 mm
|
1.22 mm
|
| Supply Voltage Limit-Max |
16 V
|
16 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.953 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3.899 mm
|
1.6 mm
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Supply Current-Max |
|
0.018 mA
|
|
|
|
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