LMC8101MWC
vs
LMC8101MWC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
WAFER
|
WAFER
|
| Package Description |
DIE, WAFER
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Common-mode Reject Ratio-Nom |
87 dB
|
87 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
5000 µV
|
5000 µV
|
| JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
NO
|
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Equivalence Code |
WAFER
|
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Min |
0.8 V/us
|
|
| Slew Rate-Nom |
1.2 V/us
|
1.2 V/us
|
| Supply Current-Max |
1.9 mA
|
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Unity Gain BW-Nom |
840
|
840
|
| Voltage Gain-Min |
560
|
|
| Wideband |
NO
|
|
| Base Number Matches |
1
|
1
|
|
|
|