LMH6559MF
vs
5962-8997501PA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
COMLINEAR CORP
|
| Part Package Code |
SOT-23
|
|
| Package Description |
SOT-23, 5 PIN
|
DIP,
|
| Pin Count |
5
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
14 µA
|
50 µA
|
| Bandwidth (3dB)-Nom |
1050 MHz
|
730 MHz
|
| Input Offset Voltage-Max |
25000 µV
|
|
| JESD-30 Code |
R-PDSO-G5
|
R-GDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2.92 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-6.5 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Min |
0.05 A
|
0.05 A
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
LSSOP
|
DIP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.22 mm
|
5.08 mm
|
| Slew Rate-Nom |
4580 V/us
|
800 V/us
|
| Supply Current-Max |
17 mA
|
|
| Supply Voltage Limit-Max |
6.5 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.95 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
1.6 mm
|
7.62 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare LMH6559MF with alternatives
Compare 5962-8997501PA with alternatives