LMH6560MTX/NOPB
vs
CLC110A8B
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP14,.25
|
,
|
Pin Count |
14
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
BUFFER
|
BUFFER
|
Average Bias Current-Max (IIB) |
14 µA
|
50 µA
|
Bandwidth (3dB)-Nom |
280 MHz
|
730 MHz
|
Input Offset Voltage-Max |
25000 µV
|
13000 µV
|
JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T8
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage Limit-Max |
-6.5 V
|
-7 V
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
8
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Current-Min |
0.05 A
|
0.05 A
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
|
Package Equivalence Code |
TSSOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.1 mm
|
|
Slew Rate-Nom |
3100 V/us
|
800 V/us
|
Supply Current-Max |
63 mA
|
20 mA
|
Supply Voltage Limit-Max |
6.5 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
3
|
Bias Current-Max (IIB) @25C |
|
50 µA
|
Slew Rate-Min |
|
500 V/us
|
|
|
|
Compare LMH6560MTX/NOPB with alternatives