LMH6560MTX/NOPB
vs
CLC111MDC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP14,.25
|
DIE,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
14 µA
|
15 µA
|
| Bandwidth (3dB)-Nom |
280 MHz
|
800 MHz
|
| Input Offset Voltage-Max |
25000 µV
|
9000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-XUUC-N4
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-6.5 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
4
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Min |
0.05 A
|
0.05 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
DIE
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Slew Rate-Nom |
3100 V/us
|
3500 V/us
|
| Supply Current-Max |
63 mA
|
|
| Supply Voltage Limit-Max |
6.5 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare LMH6560MTX/NOPB with alternatives
Compare CLC111MDC with alternatives