LMH6622MM
vs
THS4052IDGNRG4
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
MSOP
|
MSOP
|
| Package Description |
SSOP-8
|
HTSSOP, TSSOP8,.19
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
10 µA
|
8 µA
|
| Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
| Input Offset Voltage-Max |
1200 µV
|
12000 µV
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-6.6 V
|
-16.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-6 V
|
-15 V
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HTSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
1.07 mm
|
| Slew Rate-Nom |
85 V/us
|
200 V/us
|
| Supply Voltage Limit-Max |
6.6 V
|
16.5 V
|
| Supply Voltage-Nom (Vsup) |
6 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
160000
|
30000
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
6 µA
|
| Frequency Compensation |
|
YES
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Packing Method |
|
TAPE AND REEL
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
23 mA
|
| Technology |
|
BIPOLAR
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Voltage Gain-Min |
|
2000
|
| Wideband |
|
YES
|
|
|
|
Compare LMH6622MM with alternatives
Compare THS4052IDGNRG4 with alternatives