LMH6715MAX
vs
CLC410ALC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
WAFER
|
| Package Description |
SOIC-8
|
DIE, DIE OR CHIP
|
| Pin Count |
8
|
7
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| JESD-30 Code |
R-PDSO-G8
|
R-XUUC-N7
|
| JESD-609 Code |
e0
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
7
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
2
|
| Architecture |
|
CURRENT-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
20 µA
|
| Common-mode Reject Ratio-Nom |
|
50 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
5000 µV
|
| Low-Offset |
|
NO
|
| Neg Supply Voltage-Nom (Vsup) |
|
-5 V
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Slew Rate-Min |
|
430 V/us
|
| Supply Current-Max |
|
18 mA
|
| Supply Voltage Limit-Max |
|
7 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Wideband |
|
YES
|
|
|
|
Compare LMH6715MAX with alternatives
Compare CLC410ALC with alternatives