LMK03806BISQ/NOPB
vs
MAX3674ECM+T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
GREEN, WQFN-64
|
LFQFP, QFP48,.35SQ,20
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
S-XQCC-N64
|
S-PQFP-G48
|
| JESD-609 Code |
e3
|
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
64
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
1300 MHz
|
1360 MHz
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFQFP
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
QFP48,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Primary Clock/Crystal Frequency-Nom |
20.5 MHz
|
16 MHz
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.45 V
|
3.465 V
|
| Supply Voltage-Min |
3.15 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Supply Current-Max |
|
136 mA
|
|
|
|
Compare LMK03806BISQ/NOPB with alternatives
Compare MAX3674ECM+T with alternatives