LMP7300MAX/NOPB
vs
LMP7300MAX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.003 µA
|
0.004 µA
|
| Bias Current-Max (IIB) @25C |
0.003 µA
|
0.004 µA
|
| Input Offset Voltage-Max |
750 µV
|
2000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-COLLECTOR; OPEN-DRAIN
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
7700 ns
|
12000 ns
|
| Seated Height-Max |
1.75 mm
|
1.753 mm
|
| Supply Current-Max |
0.016 mA
|
0.02 mA
|
| Supply Voltage Limit-Max |
13.6 V
|
13.6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.91 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
SOIC-8
|
|
|
|