LMV324MDC
vs
MCP624T-E/STVAO
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
WAFER
|
|
| Package Description |
DIE, DIE OR CHIP
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.25 µA
|
0.005 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Common-mode Reject Ratio-Nom |
65 dB
|
84 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
7000 µV
|
200 µV
|
| JESD-30 Code |
X-XUUC-N
|
R-PDSO-G14
|
| Low-Bias |
NO
|
YES
|
| Low-Offset |
NO
|
YES
|
| Micropower |
YES
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
TSSOP
|
| Package Equivalence Code |
DIE OR CHIP
|
TSSOP14,.25
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
|
| Slew Rate-Nom |
1 V/us
|
10 V/us
|
| Supply Current-Max |
1.16 mA
|
14.4 mA
|
| Supply Voltage Limit-Max |
5.5 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
1000
|
20000
|
| Voltage Gain-Min |
10000
|
25100
|
| Wideband |
NO
|
NO
|
| Base Number Matches |
1
|
1
|
| Common-mode Reject Ratio-Min |
|
68 dB
|
| JESD-609 Code |
|
e3
|
| Length |
|
5 mm
|
| Number of Terminals |
|
14
|
| Packing Method |
|
TR
|
| Screening Level |
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
|
1.2 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
4.4 mm
|
|
|
|
Compare LMV324MDC with alternatives
Compare MCP624T-E/STVAO with alternatives