LMV339MT vs LMV339M feature comparison

LMV339MT National Semiconductor Corporation

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LMV339M National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code TSSOP SOIC
Package Description TSSOP-14 SOIC-14
Pin Count 14 14
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.25 µA 0.25 µA
Bias Current-Max (IIB) @25C 0.25 µA 0.25 µA
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 5 mm 8.65 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage-Nom (Vsup)
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Response Time-Nom 450 ns 450 ns
Seated Height-Max 1.2 mm 1.75 mm
Supply Current-Max 0.35 mA 0.35 mA
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 4.4 mm 3.9 mm
Base Number Matches 2 2

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