LMV339PWRLE
vs
LMV339MWC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSSOP
WAFER
Package Description
TSSOP, TSSOP14,.25
DIE, WAFER
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.4 µA
0.25 µA
Input Offset Voltage-Max
7000 µV
7000 µV
JESD-30 Code
R-PDSO-G14
X-XUUC-N
Length
5 mm
Number of Functions
4
4
Number of Terminals
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Equivalence Code
TSSOP14,.25
WAFER
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
400 ns
600 ns
Seated Height-Max
1.2 mm
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
2.7 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Width
4.4 mm
Base Number Matches
1
2
Bias Current-Max (IIB) @25C
0.25 µA
Output Type
OPEN-COLLECTOR
Supply Current-Max
0.35 mA
Technology
BICMOS
Compare LMV339PWRLE with alternatives
Compare LMV339MWC with alternatives