LMV339PWRLE vs LMV339MWC feature comparison

LMV339PWRLE Texas Instruments

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LMV339MWC National Semiconductor Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code TSSOP WAFER
Package Description TSSOP, TSSOP14,.25 DIE, WAFER
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.4 µA 0.25 µA
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code R-PDSO-G14 X-XUUC-N
Length 5 mm
Number of Functions 4 4
Number of Terminals 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP DIE
Package Equivalence Code TSSOP14,.25 WAFER
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Response Time-Nom 400 ns 600 ns
Seated Height-Max 1.2 mm
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 2.7 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position DUAL UPPER
Width 4.4 mm
Base Number Matches 1 2
Bias Current-Max (IIB) @25C 0.25 µA
Output Type OPEN-COLLECTOR
Supply Current-Max 0.35 mA
Technology BICMOS

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