LMV358DR2G
vs
LMV822IST
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
STMICROELECTRONICS
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
ROHS COMPLIANT, MINISOP-8
|
| Pin Count |
|
8
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
20 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Amplifier Type |
|
OPERATIONAL AMPLIFIER
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.18 µA
|
| Bias Current-Max (IIB) @25C |
|
0.12 µA
|
| Common-mode Reject Ratio-Nom |
|
75 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
4000 µV
|
| JESD-30 Code |
|
S-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Slew Rate-Min |
|
1.2 V/us
|
| Slew Rate-Nom |
|
1.7 V/us
|
| Supply Current-Max |
|
1.2 mA
|
| Supply Voltage Limit-Max |
|
6 V
|
| Supply Voltage-Nom (Vsup) |
|
2.7 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Unity Gain BW-Nom |
|
5500
|
| Voltage Gain-Min |
|
17780
|
| Wideband |
|
NO
|
| Width |
|
3 mm
|
| Base Number Matches |
|
1
|
|
|
|
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