LMV393MMX/NOPB
vs
LM139J/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
LEAD FREE, MSOP-8
|
DIP,
|
Pin Count |
8
|
14
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.25 µA
|
0.3 µA
|
Bias Current-Max (IIB) @25C |
0.25 µA
|
|
Input Offset Voltage-Max |
7000 µV
|
9000 µV
|
JESD-30 Code |
S-PDSO-G8
|
R-GDIP-T14
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
19.43 mm
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Functions |
2
|
4
|
Number of Terminals |
8
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
DIP
|
Package Equivalence Code |
TSSOP8,.19
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
450 ns
|
1300 ns
|
Seated Height-Max |
1.1 mm
|
5.08 mm
|
Supply Current-Max |
0.25 mA
|
|
Supply Voltage Limit-Max |
5.5 V
|
36 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BICMOS
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Neg Supply Voltage Limit-Max |
|
|
|
|
|
Compare LMV393MMX/NOPB with alternatives
Compare LM139J/NOPB with alternatives