LMV8172T
vs
TEA8172
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
ZIP, ZIP7,.2,.1TB
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT ALSO REQUIRES 17.5V SUPPLY
|
|
| Application |
TV; MONITOR
|
|
| Blanking Output |
NO
|
NO
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PZFM-T7
|
R-PZIP-T7
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
7
|
7
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
ZIP
|
| Package Equivalence Code |
ZIP7,.2,.1TB
|
ZIP7,.2,.1TB
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
16.9 V
|
|
| Supply Voltage-Min (Vsup) |
16.9 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Base Number Matches |
2
|
3
|
|
|
|
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