LMX2354SLDX
vs
LMX2354SLDX
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TQCCN, LCC24,.17X.14,20
|
TQCCN, LCC24,.17X.14,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
SELECTABLE PRESCALER OF 16/17 OR 20/21 AND 8/9 OR 12/13
|
SELECTABLE PRESCALER OF 16/17 OR 20/21 AND 8/9 OR 12/13
|
| Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
PLL FREQUENCY SYNTHESIZER
|
| JESD-30 Code |
R-CQCC-N24
|
R-CQCC-N24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.5 mm
|
4.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TQCCN
|
TQCCN
|
| Package Equivalence Code |
LCC24,.17X.14,20
|
LCC24,.17X.14,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, THIN PROFILE
|
CHIP CARRIER, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
8.5 mA
|
8.5 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
3.5 mm
|
3.5 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
24
|
|
|
|