LPC1758FBD80Y vs 935288608551 feature comparison

LPC1758FBD80Y NXP Semiconductors

Buy Now Datasheet

935288608551 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP
Package Description 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT315-1, 80 PIN LFQFP,
Pin Count 80
Manufacturer Package Code SOT315-1
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width
Bit Size 32 32
CPU Family CORTEX-M3
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PQFP-G80 S-PQFP-G100
JESD-609 Code e3
Length 12 mm 14 mm
Moisture Sensitivity Level 2 3
Number of I/O Lines 52 70
Number of Terminals 80 100
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 524288
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 100 MHz 100 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.4 V 2.4 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare LPC1758FBD80Y with alternatives

Compare 935288608551 with alternatives