LPV521MGX
vs
LPV521MG
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
TSSOP, TSSOP5/6,.08
|
TSSOP,
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00005 µA
|
0.00005 µA
|
| Common-mode Reject Ratio-Nom |
120 dB
|
120 dB
|
| Input Offset Voltage-Max |
1230 µV
|
1230 µV
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP5/6,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Slew Rate-Nom |
2300 V/us
|
2300 V/us
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Unity Gain BW-Nom |
6.1
|
6.1
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LPV521MGX with alternatives
Compare LPV521MG with alternatives