LSF0102DQER
vs
TDP2002F
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
| Package Description |
X2SON-8
|
SSOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
|
| Length |
1.4 mm
|
13 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Output Latch or Register |
LATCH
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
SSOP
|
| Package Equivalence Code |
SOLCC8,.04,14
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.4 mm
|
1.9 mm
|
| Supply Current-Max |
0.0125 mA
|
|
| Supply Voltage-Max |
4.5 V
|
5.25 V
|
| Supply Voltage-Min |
1 V
|
4.75 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Supply Voltage1-Max |
5.5 V
|
25 V
|
| Supply Voltage1-Min |
1.8 V
|
6 V
|
| Supply Voltage1-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.35 mm
|
1 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
24
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
BCDMOS
|
|
|
|
Compare LSF0102DQER with alternatives
Compare TDP2002F with alternatives