LSN-1.2/10-D3
vs
LSN-1.2/10-D3
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
DATEL INC
|
C&D TECHNOLOGIES INC
|
| Part Package Code |
SFM
|
SFM
|
| Package Description |
,
|
,
|
| Pin Count |
11/10
|
11/10
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
3.6 V
|
3.6 V
|
| Input Voltage-Min |
3 V
|
3 V
|
| Input Voltage-Nom |
3.3 V
|
3.3 V
|
| JESD-30 Code |
R-XSMA-P10
|
R-XSMA-P10
|
| JESD-609 Code |
e0
|
e0
|
| Load Regulation-Max |
0.25%
|
0.25%
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
71 °C
|
71 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
1.32 V
|
1.32 V
|
| Output Voltage-Min |
1.08 V
|
1.08 V
|
| Output Voltage-Nom |
1.2 V
|
1.2 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Trim/Adjustable Output |
YES
|
YES
|
| Base Number Matches |
6
|
6
|
| Pbfree Code |
|
No
|
|
|
|