LT1172MJ8
vs
MIC3172BN
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERDIP-8
|
DIP-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
J
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
40 V
|
40 V
|
| Input Voltage-Min |
3 V
|
3 V
|
| Input Voltage-Nom |
15 V
|
5 V
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Output Current-Max |
3.5 A
|
3.5 A
|
| Output Voltage-Nom |
1.24 V
|
1.24 V
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max (Isup) |
9 mA
|
9 mA
|
| Surface Mount |
NO
|
NO
|
| Switcher Configuration |
BOOST
|
SINGLE
|
| Switching Frequency-Max |
115 kHz
|
115 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
5
|
1
|
| Samacsys Manufacturer |
|
Microchip
|
| Length |
|
9.525 mm
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare LT1172MJ8 with alternatives
Compare MIC3172BN with alternatives