LT5560EDD#PBF
vs
LT5560EDD#TRPBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
Part Package Code |
DFN
|
|
Package Description |
3 X 3 MM, LEAD FREE, PLASTC, MO-229WEED-1, DFN-8
|
3 X 3 MM, LEAD FREE, PLASTC, MO-229WEED-1, DFN-8
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
DD
|
05-08-1698
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
140 MHz
|
140 MHz
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max |
5 V
|
5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MIXER
|
DSP PERIPHERAL, MIXER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Samacsys Manufacturer |
|
Analog Devices
|
External Data Bus Width |
|
|
|
|
|
Compare LT5560EDD#PBF with alternatives
Compare LT5560EDD#TRPBF with alternatives