LT6703HVIS5-3#TRPBF
vs
LT6703CDC-3#PBF
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Package Description |
LEAD FREE, PLASTIC, MO-193, TSOT-23, 5 PIN
|
HVSON,
|
| Pin Count |
5
|
3
|
| Manufacturer Package Code |
05-08-1635
|
05-08-1717
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.01 µA
|
0.01 µA
|
| JESD-30 Code |
R-PDSO-G5
|
S-PDSO-N3
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
3
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
29000 ns
|
29000 ns
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage Limit-Max |
18.5 V
|
18.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.625 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
SOLCC3/6,.09,20
|
|
|
|
Compare LT6703HVIS5-3#TRPBF with alternatives
Compare LT6703CDC-3#PBF with alternatives