LT8620HMSE#TRPBF
vs
LM25011MY/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
MSOP
|
|
| Package Description |
LEAD FREE, PLASTIC, MSOP-16
|
MSOP-10
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
MSE
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
|
| Input Voltage-Max |
65 V
|
42 V
|
| Input Voltage-Min |
3.4 V
|
6 V
|
| Input Voltage-Nom |
4 V
|
12 V
|
| JESD-30 Code |
R-PDSO-G16
|
S-PDSO-G10
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.039 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
10
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
2 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
1.1 mm
|
1.09 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
2200 kHz
|
2000 kHz
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
ALSO OPERATES IN ADJUSTABLE MODE FROM 2.51V
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
TSSOP10,.19,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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