LT8620IMSE#PBF
vs
LM25011AQ1MY/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
MSOP
|
|
Package Description |
LEAD FREE, PLASTIC, MSOP-16
|
|
Pin Count |
16
|
|
Manufacturer Package Code |
MSE
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Additional Feature |
3.4 V REGULATING OUTPUT ALSO AVAILABLE
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
|
Input Voltage-Max |
42 V
|
|
Input Voltage-Min |
4 V
|
|
Input Voltage-Nom |
6 V
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G10
|
JESD-609 Code |
e3
|
e3
|
Length |
4.039 mm
|
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
|
Number of Terminals |
16
|
10
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Current-Max |
2 A
|
|
Output Voltage-Nom |
3.29 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Seated Height-Max |
1.1 mm
|
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
|
Switching Frequency-Max |
2150 kHz
|
2000 kHz
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
|
Base Number Matches |
2
|
2
|
Package Equivalence Code |
|
TSSOP10,.19,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|