LTC2909ITS8-3.3#TRMPBF
vs
LTC2909IDDB-3.3#TRM
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Package Description |
PLASTIC, MO-193, TSOT-8
|
3 X 2 MM, PLASTIC, MO-229WECD-1, DFN-8
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
05-08-1637
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage-Min (Vsup) |
0.5 V
|
0.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.625 mm
|
2 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare LTC2909ITS8-3.3#TRMPBF with alternatives
Compare LTC2909IDDB-3.3#TRM with alternatives