LTC2977IUP#PBF
vs
LTC2977IUP#TRPBF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64
|
9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
UP
|
UP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES IN 3.3V
|
ALSO OPERATES IN 3.3V
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
9 mm
|
9 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LTC2977IUP#PBF with alternatives
Compare LTC2977IUP#TRPBF with alternatives