LTC3119HFE#PBF
vs
LTC3119HFE#TRPBF
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
TSSOP-28
|
TSSOP-28
|
Pin Count |
28
|
28
|
Manufacturer Package Code |
05-08-1663 (EA)
|
05-08-1663 (EA)
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Additional Feature |
ADJUSTABLE OUPUT MODE FROM 0.8 TO 18 V
|
ADJUSTABLE OUPUT MODE FROM 0.8 TO 18 V
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
18 V
|
18 V
|
Input Voltage-Min |
2.5 V
|
2.5 V
|
Input Voltage-Nom |
12 V
|
12 V
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
|
Length |
9.7 mm
|
9.7 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Output Voltage-Nom |
5 V
|
5 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
HTSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK-BOOST
|
BUCK-BOOST
|
Switching Frequency-Max |
2000 kHz
|
2000 kHz
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare LTC3119HFE#PBF with alternatives
Compare LTC3119HFE#TRPBF with alternatives