LTC3130EUDC#PBF
vs
LM5001SDE
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
QFN
|
|
Package Description |
QFN-20
|
4 X 4 MM, LLP-8
|
Pin Count |
20
|
|
Manufacturer Package Code |
UDC
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
Date Of Intro |
2016-08-04
|
|
Additional Feature |
ADJ OUTPUT VOLTAGE= 1V TO 25V
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
25 V
|
75 V
|
Input Voltage-Min |
0.6 V
|
3.1 V
|
Input Voltage-Nom |
12 V
|
10 V
|
JESD-30 Code |
R-PQCC-N20
|
S-XDSO-N8
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1.15 A
|
1.2 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVSON
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK-BOOST
|
BOOST
|
Switching Frequency-Max |
1400 kHz
|
900 kHz
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
3 mm
|
4 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|