LTC4225CUFD-1#TRPBF
vs
LTC4225CUFD-1#PBF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
4 X 5 MM, LEAD FREE, PLASTIC, MO-220WXXX-X, QFN-24
|
4 X 5 MM, LEAD FREE, PLASTIC, MO-220WXXX-X, QFN-24
|
| Pin Count |
24
|
24
|
| Manufacturer Package Code |
UFD
|
UFD
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PQCC-N24
|
R-PQCC-N24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
2.9 V
|
2.9 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LTC4225CUFD-1#TRPBF with alternatives
Compare LTC4225CUFD-1#PBF with alternatives