LTC4441EMSE
vs
LTC4441EMSE#PBF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
| Part Package Code |
MSOP
|
|
| Package Description |
PLASTIC, MSOP-10
|
LEAD FREE, PLASTIC, MSOP-10
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
MSE
|
05-08-1664
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| High Side Driver |
NO
|
NO
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G10
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Peak Current Limit-Nom |
6 A
|
6 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Equivalence Code |
TSSOP10,.19,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max |
25 V
|
25 V
|
| Supply Voltage-Min |
5 V
|
5 V
|
| Supply Voltage-Nom |
7.5 V
|
7.5 V
|
| Supply Voltage1-Max |
8 V
|
8 V
|
| Supply Voltage1-Min |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|