LTC6400CUD-14#TRPBF
vs
LTC6400CUD-14#PBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
QFN
|
QFN
|
Package Description |
3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16
|
3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
UD
|
UD
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Nom |
62 dB
|
62 dB
|
Input Offset Voltage-Max |
3000 µV
|
3000 µV
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Slew Rate-Nom |
6000 V/us
|
6000 V/us
|
Supply Voltage Limit-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LTC6400CUD-14#TRPBF with alternatives
Compare LTC6400CUD-14#PBF with alternatives