LTC6400IUD-26#PBF
vs
LTC6400CUD-26#PBF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16
|
3 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, MO-220WEED-2, QFN-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
UD
|
UD
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Nom |
75 dB
|
75 dB
|
| Input Offset Voltage-Max |
2000 µV
|
2000 µV
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Slew Rate-Nom |
6670 V/us
|
6670 V/us
|
| Supply Voltage Limit-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LTC6400IUD-26#PBF with alternatives
Compare LTC6400CUD-26#PBF with alternatives