LTC6405CUD#TR
vs
LTC6405IMS8E#TR
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
HQCCN, LCC16,.12SQ,20
|
HTSSOP, TSSOP8,.19
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Bandwidth (3dB)-Nom |
800 MHz
|
750 MHz
|
Common-mode Reject Ratio-Min |
50 dB
|
50 dB
|
Common-mode Reject Ratio-Nom |
75 dB
|
75 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Current-Max (IIO) |
4 µA
|
4 µA
|
Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
JESD-30 Code |
S-PQCC-N16
|
S-PDSO-G8
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
3 mm
|
Low-Offset |
NO
|
NO
|
Micropower |
NO
|
NO
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HQCCN
|
HTSSOP
|
Package Equivalence Code |
LCC16,.12SQ,20
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Programmable Power |
NO
|
NO
|
Seated Height-Max |
0.8 mm
|
1.1 mm
|
Slew Rate-Nom |
690 V/us
|
690 V/us
|
Supply Current-Max |
23 mA
|
23 mA
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Unity Gain BW-Nom |
2700000
|
2700000
|
Wideband |
YES
|
YES
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare LTC6405CUD#TR with alternatives
Compare LTC6405IMS8E#TR with alternatives