LTC6652BHLS8-2.5#PBF
vs
LT6654BHLS8-2.5#PBF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
LINEAR TECHNOLOGY CORP
|
| Package Description |
LCC-8
|
LCC-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
05-08-1852
|
LS8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Analog IC - Other Type |
THREE TERMINAL VOLTAGE REFERENCE
|
THREE TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
S-CQCC-N8
|
S-CQCC-N8
|
| Length |
5 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
2.5025 V
|
2.5025 V
|
| Output Voltage-Min |
2.4975 V
|
2.4975 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HQCCN
|
HQCCN
|
| Package Equivalence Code |
LCC8,.2SQ
|
LCC8,.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max (Vsup) |
13.2 V
|
36 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
10 ppm/°C
|
20 ppm/°C
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Trim/Adjustable Output |
NO
|
NO
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
LCC
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
| Voltage Tolerance-Max |
|
0.43%
|
|
|
|
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