LX1732CDU
vs
MAX1672EEE+
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
MSOP
|
SOIC
|
| Package Description |
LEAD FREE, PLASTIC, MSOP-8
|
0.150 INCH, QSOP-16
|
| Pin Count |
8
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE FREQUENCY MODULATION
|
PULSE FREQUENCY MODULATION
|
| Input Voltage-Max |
5.5 V
|
11 V
|
| Input Voltage-Min |
1.1 V
|
1.8 V
|
| Input Voltage-Nom |
2 V
|
2 V
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
4.89 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Current-Max |
1 A
|
1.1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.73 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Switching Frequency-Max |
135 kHz
|
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
SSOP16,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LX1732CDU with alternatives
Compare MAX1672EEE+ with alternatives