LX5225CDWP
vs
UC5602QP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
PLASTIC, SOP-28
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
28
|
28
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
NO
|
NO
|
Interface IC Type |
SCSI BUS TERMINATOR
|
SCSI BUS TERMINATOR
|
JESD-30 Code |
R-PDSO-G28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
|
Length |
17.9 mm
|
11.5062 mm
|
Number of Functions |
1
|
1
|
Number of Signal Lines |
18
|
18
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSOP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
CHIP CARRIER
|
Pull-up Resistance-Nom |
110 Ω
|
110 Ω
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
4.57 mm
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4 V
|
4 V
|
Supply Voltage-Nom |
4.75 V
|
4.75 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
11.5062 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LX5225CDWP with alternatives
Compare UC5602QP with alternatives