LX5225CDWP vs UC5603DPR feature comparison

LX5225CDWP Microsemi Corporation

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UC5603DPR Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description PLASTIC, SOP-28 SOP, SOP16,.25
Pin Count 28 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output NO NO
Interface IC Type SCSI BUS TERMINATOR SCSI BUS TERMINATOR
JESD-30 Code R-PDSO-G28 R-PDSO-G16
JESD-609 Code e0
Length 17.9 mm 9.9 mm
Number of Functions 1 1
Number of Signal Lines 18 9
Number of Terminals 28 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG SMALL OUTLINE
Pull-up Resistance-Nom 110 Ω 110 Ω
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.75 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4 V 3.8 V
Supply Voltage-Nom 4.75 V 4.75 V
Surface Mount YES YES
Technology BICMOS BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code No
Package Equivalence Code SOP16,.25

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