LX5225CDWP vs UC5603QP feature comparison

LX5225CDWP Microsemi Corporation

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UC5603QP Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC
Package Description PLASTIC, SOP-28 PLASTIC, LCC-28
Pin Count 28
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output NO NO
Interface IC Type SCSI BUS TERMINATOR SCSI BUS TERMINATOR
JESD-30 Code R-PDSO-G28 S-PQCC-J28
JESD-609 Code e0
Length 17.9 mm 11.505 mm
Number of Functions 1 1
Number of Signal Lines 18 9
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG CHIP CARRIER
Pull-up Resistance-Nom 110 Ω 110 Ω
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.57 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4 V 3.8 V
Supply Voltage-Nom 4.75 V 4.75 V
Surface Mount YES YES
Technology BICMOS BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.5 mm 11.505 mm
Base Number Matches 2 2
Package Equivalence Code LDCC28,.5SQ
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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