LXP2180APE
vs
DS2180AQN+
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCJ, LDCC44,.7SQ
|
QCCJ,
|
Pin Count |
44
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Carrier Type |
T-1(DS1)
|
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
JESD-609 Code |
e0
|
e3
|
Length |
16.5862 mm
|
16.5862 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC44,.7SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Current-Max |
10 mA
|
10 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.5862 mm
|
16.5862 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare LXP2180APE with alternatives
Compare DS2180AQN+ with alternatives