M1215GD1U
vs
M1212GS1U-G
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
,
|
| Pin Count |
14/6
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| Additional Feature |
ADDITIONAL -15V OUTPUT AVAILABLE
|
ADDITIONAL -12V OUTPUT AVAILABLE
|
| Analog IC - Other Type |
DC-DC UNREGULATED POWER SUPPLY MODULE
|
DC-DC UNREGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
13.2 V
|
13.2 V
|
| Input Voltage-Min |
10.8 V
|
10.8 V
|
| Input Voltage-Nom |
12 V
|
12 V
|
| JESD-30 Code |
R-XDMA-P6
|
R-XSMA-P5
|
| Length |
20.4 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
2
|
2
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Nom |
15 V
|
12 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
7.3 mm
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
SINGLE
|
| Total Power Output-Max |
1 W
|
1 W
|
| Trim/Adjustable Output |
NO
|
NO
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare M1215GD1U with alternatives
Compare M1212GS1U-G with alternatives