M145026B1
vs
TEA5500TD
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
0.250 INCH, PLASTIC, DIP-16
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
REMOTE CONTROL TRANSMITTER/RECEIVER IC
|
SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
80 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.1 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
6.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmission Media |
RF
|
INFRARED
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
10.3 mm
|
|
|
|
Compare M145026B1 with alternatives
Compare TEA5500TD with alternatives