M1A3P1000-FGG256I
vs
M1A3P1000-FGG256IY
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
FPBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
350 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
24576
|
|
Number of Equivalent Gates |
1000000
|
1000000
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
24576 CLBS, 1000000 GATES
|
1000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Packing Method |
TRAY
|
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.8 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
1
|
Date Of Intro |
|
2016-03-25
|
Additional Feature |
|
TERM PITCH-MIN
|
|
|
|
Compare M1A3P1000-FGG256I with alternatives
Compare M1A3P1000-FGG256IY with alternatives