M1A3P250-1VQ100I
vs
M1A3P250-1FGG144Y
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
| Package Description |
14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100
|
LBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G100
|
S-PBGA-B144
|
| JESD-609 Code |
e0
|
e1
|
| Length |
14 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
250000
|
250000
|
| Number of Terminals |
100
|
144
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Packing Method |
TRAY
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
14 mm
|
13 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
144
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P250-1VQ100I with alternatives
Compare M1A3P250-1FGG144Y with alternatives