M1A3P600-2FGG256I vs M1A3P600-2FGG144YI feature comparison

M1A3P600-2FGG256I Microchip Technology Inc

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M1A3P600-2FGG144YI Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 LBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B144
JESD-609 Code e1 e1
Length 17 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 177
Number of Outputs 177
Number of Terminals 256 144
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.8 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 13 mm
Base Number Matches 3 1
Part Package Code BGA
Pin Count 144

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Compare M1A3P600-2FGG144YI with alternatives