M1A3P600L-PQ208I
vs
M1A3P600L-FGG256YI
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
| Package Description |
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208
|
BGA, BGA256,16X16,40
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
250 MHz
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e1
|
| Length |
28 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
13824
|
|
| Number of Equivalent Gates |
600000
|
|
| Number of Inputs |
154
|
177
|
| Number of Logic Cells |
13824
|
13824
|
| Number of Outputs |
154
|
177
|
| Number of Terminals |
208
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
13824 CLBS, 600000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
BGA
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P600L-PQ208I with alternatives
Compare M1A3P600L-FGG256YI with alternatives