M1A3PE3000-2FGG484 vs M1A3PE3000-2FG484I feature comparison

M1A3PE3000-2FGG484 Microsemi Corporation

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M1A3PE3000-2FG484I Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA484,22X22,40 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 75264 75264
Number of Equivalent Gates 3000000 3000000
Number of Inputs 341 341
Number of Logic Cells 75264 75264
Number of Outputs 341 341
Number of Terminals 484 484
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 75264 CLBS, 3000000 GATES 75264 CLBS, 3000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
Base Number Matches 5 1
Factory Lead Time 12 Weeks
Samacsys Manufacturer Microchip
Packing Method TRAY

Compare M1A3PE3000-2FGG484 with alternatives

Compare M1A3PE3000-2FG484I with alternatives