M2GL005-VF256I vs M2GL005-VFG256I feature comparison

M2GL005-VF256I Microchip Technology Inc

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M2GL005-VFG256I Microchip Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 14 X 14 MM, 0.80 MM PITCH, VFBGA-256 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.31.00.01
Factory Lead Time 8 Weeks 4 Weeks
Samacsys Manufacturer Microchip Microchip
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0
Length 14 mm 14 mm
Number of Inputs 161 161
Number of Outputs 161 161
Number of Terminals 256 256
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA256,16X16,32 BGA256,16X16,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TRAY TRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.56 mm 1.56 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30